Compact, cost effective system for start of production and limited
BrochuresPlease click the picture to download the brochure in PDF formatEVG100 Series Short Brochure.pdf
Technical PapersPlease click the titles to download the full papers in PDF formatInvestigating the use of spray-coating technology in MEMS applicationsAbstract: Fabricating the many different varieties of of microelectromechanical systems (MEMS) poses complex processing challenges, particularly in the lithography area. Since MEMS devices rely on mechanical elements, they incorporate three-dimensional microstructures....Microring resonators fabrication by BCB adhesive wafer bondingAbstract: Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications because of their inherent spectral characteristics. GaInAsP/InP microring resonator devices were fabricated using a vertical integration concept based on GaInAsP/InP-on-GaAs wafer-to-wafer bonding...Ultra-thick lithography for advanced packaging and MEMSAbstract: An ever increasing need exists for thick resist layers in the processing of MEMS and for advanced packaging. Applications in the MEMS field include bulk micromachining, surface micromachining, and the actual creating of active device structures... Wafer level packaging on Cu/low-K, high density back-end integrated circuitsAbstract: The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. Wafer level packaging is a promising technology to meet future demands of increase performance for advanced integrated circuits with tighter pitch (higher feature density) higher I/O counts and Cu metallization with low-k dielectric layers...Wafer-scale BCB resist-processing technologies for high density integration and electronic packagingAbstract: IC performance is drastically limited by line-to-line capacity coupling and RC interconnect delay times resulted from the continuous increase in integration densities with 0.10µm line and space width approaches, as well from increased signal frequencies. The new achievements in terms of circuit lines shrinkage emphasize the need for the introduction of Cu and low-k dielectric materials...
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
EVG and NNFC announced results on improved transparent nanostructured anti-reflective coatings for next-gen displays
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CS International 2017
IMAPS Device Packaging 2017
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