EVG®105 Bake Module

Designed for soft or post exposure bake processes.

 

  • Max. wafer size: 300 mm
  • Max. square substrate size (edge length): 300 mm
  • Max. hotplate temperature: 150 °C or 250 °C
  • Temperature uniformity: <+/-1 °C @ 100 °C
  • Suitable wafer handling equipment required (e.g. vacuum tweezers)
  • Electrical hook up: 120V or 230V,
  • Power consumption: Approximately 2.3kW
  • Table required