EVG®105 Bake Module

Designed for soft or post exposure bake processes.

 

Softbake, post-exposure bake and hardbake processes can be performed. Controlled baking environment assures uniform evaporation. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles.

Features

  • Stand-alone bake module
  • Max. temperature 150 °C
  • Lift pins for manual wafer loading/unloading
  • Timer for bake
  • Substrate vacuum (direct contact bake)
  • Options:
    - N2 purge
    - Proximity bake 0-1 mm distance wafer to heat plate
    - Max. temperature up to 250 °C