Softbake, post-exposure bake and hardbake processes can be
performed. Controlled baking environment assures uniform evaporation.
Programmable proximity pins provide the best available control of resist
hardening processes and temperature profiles.
- Stand-alone bake module
- Max. temperature 150 °C
- Lift pins for manual wafer loading/unloading
- Timer for bake
- Substrate vacuum (direct contact bake)
- N2 purge
- Proximity bake 0-1 mm distance wafer to heat plate
- Max. temperature up to 250 °C