For hot embossing applications of polymer substrates and spin-on polymers
with excellent pattern fidelity.
Singapore-MIT Alliance for Research Technology Orders EVG Automated Production Bonding System
EV Group Completes Next Expansion Phase of Corporate Headquarters
more news ..
SPIE Micro+Nano Materials, Devices, and Applications
3D Architectures for Semiconductor Integration and Packaging
more events ..
EV Group Breaks through Resolution Barrier with Introduction of Soft UV Nanoimprint Lithography Technology
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments
Consortium for Commercialization of Nano Imprint Lithography (NIL)