The EVG750 is designed for high volume embossing and nanoimprinting
applications of spin-on polymers as well as polymer substrates. It combines
an alignment module, a high contact force imprinting module and a
de-embossing station in a fully automated system targeting mainly
microfluidic applications.
Features
- High volume hot embossing and nanoimprinting applications
- Fully-Automated embossing process
- Rapid cooling procedure
- EVG's proprietary separated alignment process for optically aligned
embossing and imprinting