For semi-automatic or fully-automatic single and double-side µ-CP processes.
Advanced Packaging and 3D-IC Market driving strong growth for EV Group's automated 300-mm polymer adhesive wafer bonding systems
EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference
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SEMICON Europa 2015
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New Wafer-Level Microlens Molding Process from EV Group
Himax Technologies Selects EVG to Expand Production Capacity for WLO
EV Group Corporate Video