For semi-automatic or fully-automatic single and double-side µ-CP processes.
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
EVG and NNFC announced results on improved transparent nanostructured anti-reflective coatings for next-gen displays
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CS International 2017
IMAPS Device Packaging 2017
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New Wafer-Level Microlens Molding Process from EV Group
Himax Technologies Selects EVG to Expand Production Capacity for WLO
EV Group Corporate Video