EVG®6200∞ Automated µ-CP System

For pattern creation in UV-curable materials from a prestructured stamp to a substrate.

 

  • Substrate / Wafer parameters:
    Size: 3", 100mm, 150mm, up to 200 x 200mm; Thickness: 0.1 - 10mm
  • Stamp parameters: Size: 25mm x 25mm up to 200mm; Thickness: <7mm
  • General system configuration:
    Desktop system: standard; System rack: option; Vibration isolation: passive
  • Alignment accuracy:
    Top side alignment: ± 1.0 µm 3σ; by using dedicated Moiré alignment keys +/- 100 nm can be reached
    Large gap alignment: Option / ± 1.5µm 3σ
    NanoAlign: Option
  • Alignment stage:
    Precision micrometers: Manual, motorized (option)
    Wedge compensation: Internal 0.5 - 40N contact force
  • Exposure:
    Modes: soft and vacuum contact
    Resolution: < 50 nm, mainly dependent on CD of stamp
    Wavelength: 200 - 240 nm / 240 - 280 nm / 280 - 350 nm / 350 - 450 nm, filters (option)
    Mercury arc lamp: 350 / 500 / 1000 W
  • Automatic alignment: Option
  • Handling system: 3 cassette stations, 5 stations (option), field upgradeable
  • SECS/GEM II: Option