EVG®750 Automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

 

  • Up to 200x200mm substrate size
  • Temperature up to 250°C
  • Contact force range up to 360kN
  • Independent temperature control of top and bottom heaters
  • Automated de-embossing process
  • Rapid cooling procedure
  • Precise temperature control
  • Excellent temperature uniformity