EVG®750 Automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

 

 The EVG750 is designed for high volume embossing and nanoimprinting applications of spin-on polymers as well as polymer substrates. It combines an alignment module, a high contact force imprinting module and a de-embossing station in a fully automated system targeting mainly microfluidic applications.

Features

  • High volume hot embossing and nanoimprinting applications
  • Fully-Automated embossing process
  • Rapid cooling procedure 
  • EVG's proprietary separated alignment process for optically aligned embossing and imprinting