EVG®520HE Semi-Automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

 

Technical Papers
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Fabrications of micro-channel device by hot emboss and direct bonding of PMMA
Abstract: We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water...



Impact of vacuum environment on the hot embossing process
Abstract: One of the key questions concerning the concept of a system for hot embossing lithography is whether or not it should provide for imprinting under vacuum. We have performed experiments comparing the embossing in vacuum and in atmospheric pressure in a semi-automated imprint system. The stamps used were fully patterned, 10cm diameter with pattern sizes ranging from 400nm to 100µm...



Nanoimprint lithography a next generation high volume lithography technique
Abstract: Nanoimprint Lithography has been demonstrated to be one of the most promising next generation techniques for large-area structure replication in the nanometer scale. This fast and low cost method becomes an increasingly important instrument for fabrication of biochemistry, µ-fluidic, µ-TAS and telecommunication devices, as well as for a wide variety of fields in the nm range, like biomedical, nano-fluidics, nano-optical applications, data storage, etc...



Nanoimprint lithography - full wafer replication of nanometer features
Abstract: Nanoimprint Lithography (NIL) is a fast, high resolution replication technology for micromechanics, microbiology and even for microelectronic applications in the sub-100nm range. The technique has been demonstrated to be a very promising next generation technique for large-area structure replication up to wafer-level in the micrometer and nanometer scale...



Nanoimprint lithography with a commercial 4”-bond system for hot embossing
Abstract: In order to examine the suitability of nanoimprinting for wafer scale pattern definition, a commercially available hot embossing system, the EV520HE of EVGroup, Austria, has been used to imprint 4 inch substrates. The EV520HE is based on a production-proven wafer bonding system which guarantees compatibility with semiconductor fabrication conditions...



Nanostructuring of polymers by hot embossing lithography
Abstract: While researchers of ever more advanced NGL systems are still struggling to demonstrate the feasibility to manufacture features well below 100 nm at an affordable cost and a reasonable throughput, nanoimprint technologies are emerging as a possible answer to these challenges. 100 nm patterns are imprinted with a fully patterned 4 inch diameter stamp in a low-temperature embossing process...



One micron precision optically aligned method for hot-embossing and nanoimprinting
Abstract: This paper reports an optically aligned hotembossing and imprinting method for biomedical, microfluidic, and microoptical sensors. Hot-embossing technology is a low cost, flexible fabrication method, which has demonstrated high aspect ratio polymer microstructures as well as nanoimprinting patterns. It uses polymer substrates to imprint a pattern created on a master stamp...
 

Transition of MEMS technology to nanofabrication
Abstract: The transition of MEMS technology to nano fabrication is a solution to the growing demand for smaller and high-density feature sizes in the nanometer scale. Techniques for fabricating µm-, and nm-features will be discussed, and results achieved with nanoimprinting technologies will be presented...