IQ Aligner® Automated Mask Alignment System

Optimized for contactless proximity processing at highest throughput. Most accurate print gap control and unmatched uptime are fully addressing HVM requirements.

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Substrate / Wafer parameters:
Size: 150mm, 200mm, 300mm; Thickness: 0.1 - 15mm
Mask parameters: Size: max. 14"x14"; Thickness: <13mm
General system configuration:
System rack: standard; Vibration isolation: active
Alignment accuracy:
Top side alignment: ± 0.5µm 3σ
Bottom side alignment: Option / ± 0.75µm 3σ
IR alignment: Option / substrate depending
Large gap alignment: Option / ± 1µm 3σ
Bond alignment: Option
NanoAlign: Standard
Alignment stage:
Precision micrometers: Motorized
Wedge compensation: Internal 0.5 - 100N contact force,
proximity spacers (option), 100% contactless (option)
Exposure:
Modes: Proximity, soft-, hard, and vacuum contact
Resolution: <1µm in vacuum contact, </= 2µm in proximity
Wave length: 200 - 240nm / 240 - 280nm / 280 - 350nm / 350 - 450nm, filters (option)
Mercury arc lamp: 500 / 1000 / 5000W
Nanoimprint lithography: Optional tools available for UV-Nanoimprint Lithography and micro contact printing to achieve sub 100nm features
Automatic alignment: Option
Handling system: 3 cassette stations (up to 200mm) or 2 FOUP load ports / 300 mm
Automatic mask loading: Option
SECS/GEM II: Option
Lithography Track System Hercules: up to 300 mm

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