EVG®620HBL Gen II Fully Automated Mask Alignment System for HB-LED

Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.

Overview Technical Data Downloads

 

  • Wafer diameter (Substrate size/mm): 50-150 mm
  • Substrate materials: AIN, ceramic, metal, sapphire, Si, SiC
  • Throughput:
    Up to 165 wafer/hour (aligned)
    Up to 220 wafer/hour (first print)
  • Top Side Live Alignment Accuracy: +/- 1.0 µm
  • Bottom Side Alignment Accuracy: Option / +/- 1.5 µm
  • Exposure processes : Proximity, Soft-, Hard- and Vacuum contact
  • Pattern resolution :
    ≤ 0.6 µm (Vacuum contact)
    ³ 2.0 µm (Proximity)
  • Footprint:  1.7 m2
  • Wafer cassette mapping: Standard
  • SECS II/GEM interface : Optional
  • Typical customer application:  LED high volume manufacturing

 

Products

Advanced Product Search

News and Events

VLSIresearch announces THE BEST 2013 Suppliers

VLSIresearch announces winners of the 2013 10 BEST Suppliers of Chip Making Equipment awards

more news ..

ECTC 2013

sensors expo & conference 2013

more events ..

TBDB_AD_Feb_13
See Also

Related Markets

EV Group Addresses Fast-Growing HB-LED Market with Launch of EVG620HBL Mask Alignment System

Technical Papers

Product Range

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

2012_05_vlsi
EVG in Top Five of the VLSIresearch 2012 Customer Satisfaction Survey