EVG®150 Automated Resist Processing System up to 300mm
Fully-automated coat/develop process and high-throughput performance.
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Max. wafer size: 300 mm
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Max. square substrate size (edge length): 200 mm
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Max. number of spin modules (coat/develop): 4
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Max. number of further modules (hot plates, chill
plates, vapor prime): 18
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Spray coating:
Spray nozzle programmable parameters: Speed (rpm), acceleration
(rpm/s),
absolute position
Park position and dummy dispense
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Spin coating:
Drive unit up to 10.000rpm, ramp-up speed up to 40.000 rpm/s
Park position and dummy dispense
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Developing:
Pressurized tank, flow control
Nitrogen nozzle for atomizing developer in spray mode; also suitable
for puddle
and stream (rinse) develop
Park position and dummy dispense
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Max. hotplate temperature: 350 °C
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Automation options:
Resist pumps for spin coating:
- For resist viscosities up to 50000cP
- Up to 15ml dispense volume, up to 5ml/s dispense rate
- Suckback programmable for best uniformity
Resist pumps for spray coating:
- Precise flow control 10µl/s up to 200µl/s for low viscosity resist