• Go to the main navigation
  • Go to content
 
EV Group
login
t-shop
  • EVGroup.com>>
  • Products>>
  • Lithography>>
  • Resist Processing Systems>>
  • EVG®150N

EVG®150 Automated NanoSpray Coating System

NanoSpray allows a new bandwidth of applications throughout many technologies in semiconductor processing markets.

Overview Technical Data Gallery Downloads Videos

 

 

 

Products

  • Lithography
    • Mask Alignment Systems
    • Resist Processing Systems
      • EVG®101
      • EVG®101LA
      • EVG®105
      • EVG®120
      • EVG®150
      • EVG®150N
    • Lithography Track Systems
    • Nanoimprint Lithography Systems (UV-NIL, µCP, HE)
    • Inspection Systems
  • Bonding
  • Process Technology
Advanced Product Search

News and Events

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

EV Group Ships 300mm Wafer Bonding System to Leading Chinese Semiconductor Foundry

more news ..

ECTC 2013

sensors expo & conference 2013

more events ..

TBDB_AD_Feb_13
See Also

Related Markets

EV Group Supplies 300-mm Equipment to STMicroelectronics

Technical Papers

Product Range

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References


2008 Advanced Packaging Award Winners At SEMICON West
EVG150 NanoSpray
Category: Surface Treatment Equipment & Materials

 
  • About
    • Vision/Mission
    • Awards
    • Certificates
    • Events
      • EVG Technology Days and Workshops
    • History
    • News
      • News Archive 2012
      • News Archive 2011
      • News Archive 2010
      • News Archive 2009
      • News Archive 2008
      • News Archive 2007
      • Picture Gallery
    • Purchasing
      • Demands
        • Mechanics
        • Electronics
        • Pneumatics
        • Fluidics
        • Vaccuum
        • Optical
      • Purchasing Conditions
      • Requirements
      • Purchasing Portal
    • Representatives & Industry Organizations
    • Environmental Policy
    • Overview
  • Products
    • Overview
    • Lithography
      • Mask Alignment Systems
        • EVG®610
        • EVG®620
        • EVG®620HBL Gen II
        • EVG®620NT
        • EVG®6200∞
        • EVG®6200NT
        • IQ Aligner®
      • Resist Processing Systems
        • EVG®101
        • EVG®101LA
        • EVG®105
        • EVG®120
        • EVG®150
        • EVG®150N
      • Lithography Track Systems
        • Hercules®
      • Nanoimprint Lithography Systems (UV-NIL, µCP, HE)
        • EVG®620
        • EVG®6200∞
        • IQ Aligner®
        • EVG®770
        • EVG®510HE
        • EVG®520HE
        • EVG®750
      • Inspection Systems
        • EVG®40
        • EVG®40NT
    • Bonding
      • Wafer Bonding Systems
        • EVG®501
        • EVG®510
        • EVG®520IS
        • EVG®540
        • EVG®540C2W
        • EVG®560
        • EVG®560HBL
      • Bond Alignment Systems
        • EVG®620
        • EVG®6200∞
        • SmartView®
        • SmartView®NT
      • Integrated Bonding Systems
        • Gemini®
        • GeminiFB®
      • SOI Bonding Systems
        • EVG®301
        • EVG®320
        • EVG®810LT
        • EVG®850
      • Temporary Bonding and Debonding Systems
        • EVG®805
        • EVG®850TB
        • EVG®850DB
        • EVG®820
        • ZoneBOND®
        • XT Frame Platform
      • Inspection Systems
        • EVG®20
        • EVG®40NT
    • Process Technology
  • Solutions
    • Overview
    • 3D IC
      • Introduction
      • Chip Stacking for 3D IC
      • Advanced C2W Bonding
      • Wafer Bonding for 3D IC
      • Thin Wafer Processing
        • Introduction
        • Tape Debonding
        • Thermal Slide Off Debonding
        • EVG® LowTemp™ ZoneBOND®
          • Introduction
          • Open Platform
    • CMOS Image Sensors
      • Introduction
      • Backend Lithography
      • Glass Bonding
      • Oxide Bonding
    • High Brightness LEDs
      • Introduction
      • Layer Transfer
      • Imprint Lithography
      • Optical Lithography
      • Thin Wafer Handling
    • Logic / Memory
      • Introduction
      • Backend Lithography
      • Wafer Level Bonding
      • C2W Bonding
      • Thin Wafer Handling
    • MEMS Devices
      • Introduction
      • Lithography
      • First Level Packaging
    • Microfluidics
      • Introduction
      • Hot Embossing
      • Wafer Level Bonding
    • SAW Devices
      • Introduction
      • Wafer Level Bonding
    • SOI Wafers
      • Introduction
      • Cleaning
      • Plasma Activation
      • Oxide Bonding
    • Wafer Level Optics
      • Introduction
      • Imprint Lithography
      • UV Bonding
    • Photovoltaics
      • Introduction
      • Imprint Lithography
      • Micro Optics
      • Wafer Bonding
      • Thin PV Wafers
      • Spray Coating
      • Optical Lithography
      • Anti-Reflective Coatings
  • Markets
    • Overview
    • Advanced Packaging, 3D Interconnect
    • Compound Semiconductor and Silicon-Based Power Devices
    • MEMS
    • Nanotechnology
    • SOI & Engineered Substrates
  • Services
    • Overview
    • Process Technology
    • Customer Support
      • Field-Service On-site Visits
      • Technical Support Call Center
      • Spare Parts
      • Product Improvements
      • Training
        • Training Request
      • Extended Equipment Warranty
      • Preventive Maintenance Agreement
      • On-site Service Agreement
  • Careers
  • Contact us
 
© EV Group, ALL RIGHTS RESERVED