EVG®150 Automated NanoSpray Coating System

NanoSpray allows a new bandwidth of applications throughout many technologies in semiconductor processing markets.

Max. wafer size: 300 mm
Max. number of spin modules (coat/develop): 3
Max. number of further modules (hot plates, chill plates, vapor prime): 12
Spray coating:
Spray nozzle programmable parameters: Speed (rpm), acceleration (rpm/s),
absolute position
Park position and dummy dispense
NanoSpray:
For coating vias with Ø down to 20 µm and aspect ratios up to 1:4 and more,
sidewall angle can be vertical.
Max. hotplate temperature: 350 °C
Automation options:
Resist pumps for spray coating:
- Precise flow control 10µl/s up to 200µl/s for low viscosity resist