NanoSpray allows a new bandwidth of applications throughout many
technologies in semiconductor processing markets.
This enhanced, patent pending spray coating technique is used for coating
very small, but deep patterns. It is especially useful for coating vias
with diameter of less than 200µm and aspect ratios of up to 1:4 and more.
Side wall angle can be vertical.
Features
- Unique spray process that is based on a spray mist created by
ultrasonic nozzles
- Significant improvement in refined dispense and targeted positioning of
the spray stream
- Fast and cost efficient deposition of organic low k dielectric
materials
- Options
- SMIF Input output modules (for 150 and 200 mm)
- FOUP load ports (for 200 and 300 mm)
- Temperature controlled resist lines
- Vapor Prime