Single wafer processing in R&D and small scale production.
The EVG101 series perform R&D type processes on a single chamber
design, which is fully compatible with our automated systems. The EVG101
supports wafers up to 300 mm and can be configured for spin or spray
coating and developing. Conformal layers of photoresist or polymers are
achieved on 3D structured wafers for interconnection techniques with EVG's
advanced OmniSpray® coating technology. This ensures low
material consumption of precious high-viscosity photoresists or polymers
while improving uniformity and resist spreading options.
Features
- Automated spin or spray coating or developing with manual wafer
load/unload
- Easy process transfer from research to production utilizing proven
modular design
- Syringe dispense system for utilization of small resist volumes,
including high viscosity resists
- Small footprint while maintaining a high level of personal and process
safety
- Options:
- Uniform coating of high topography wafer surfaces with
OmniSpray® coating technology
- Wax and Epoxy coating for subsequent bonding processes
- Spin-On-Glass (SOG) coating