The company's key competencies in lithographic technology lie in the
high-throughput contact and proximity exposure capabilities of its mask
aligners (EVG600, EVG6000, EVG IQ series) and in its highly integrated
coating platform (EVG100 series). All of EVG's lithography equipment
platforms are 300mm ready, can be fully integrated into its HERCULES
lithography track systems, and are complemented by its metrology tools for
top-to-bottomside alignment verification.
Other important advancements by EV Group in the lithography space include
the company's special resist coating technologies - OmniSpray and, most
recently, the revolutionary NanoSpray. Not only do these unique
technologies allow for extremely conformal coatings over high-topography
structures - for example, through-silicon-via (TSV) structures with an
aspect ratio of 1:5 (W:H) - but, ultimately, they enable customers to
realize significantly reduced fabrication costs.
Through its commitment to continued innovation and customer collaboration,
EVG has consistently raised the bar for cost-effective, nanometer-scale
lithography processing. This future-focused approach enabled the
accelerated introduction of its UV-nanoimprint lithography (UV-NIL) and
hot-embossing systems. Today, the company holds the dominant market share
in these promising technologies.