Configurable for all wafer bonding processes such as eutectic, thermo compression, fusion bonding, or LowTemp plasma bonding.
EV Group Joins IRT Nanoelec 3D Integration Program
Korean National Nanofab Center Installs High-Vacuum Wafer Bonder from EV Group for Advanced MEMS Research and Foundry Services
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CS International 2016
PIC International 2016
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EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video