For permanent bonding on chips to wafer (C2W) on wafer scale.
Singapore-MIT Alliance for Research Technology Orders EVG Automated Production Bonding System
EV Group Completes Next Expansion Phase of Corporate Headquarters
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3D Architectures for Semiconductor Integration and Packaging
SEMI European 3D TSV Summit 2014
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EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments