For permanent bonding on chips to wafer (C2W) on wafer scale.
EVG Unveils Room-Temp Covalent Bonder for Engineered Substrate and Power Device Production
EVG Clears Key Barriers to 3D-IC/TSV HVM with Breakthrough Fusion Wafer Bonding Solution
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EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments