For permanent bonding on chips to wafer (C2W) on wafer scale.
EVG Next-Gen NIL Technology Targets Photonics, LED and Bioengineered Device Production
EVG Unveils Room-Temp Covalent Bonder for Engineered Substrate and Power Device Production
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SAW Symposium 2014
MEMS Executive Congress US 2014
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EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments