For permanent bonding on chips to wafer (C2W) on wafer scale.
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
EVG and NNFC announced results on improved transparent nanostructured anti-reflective coatings for next-gen displays
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CS International 2017
IMAPS Device Packaging 2017
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EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video