For permanent bonding on chips to wafer (C2W) on wafer scale.
EVG wins Compound Semiconductor Manufacturing Award at the CSindustry awards 2014
EV Group Establishes China Headquarters in Shanghai
more news ..
SEMATECH Surface Preparation and Cleaning Conference 2014
MEMS Industry Group Conference Japan 2014
more events ..
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments