Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.
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Advanced Packaging and 3D-IC Market driving strong growth for EV Group's automated 300-mm polymer adhesive wafer bonding systems
EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference
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Nemotek Technologie selects EV Group's Solutions for Capacity Ramp
EV Group Strengthens Presence in Middle East
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video