Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.
EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference
EV Group Receives 3D InCites Award for GEMINI FB XT Automated Fusion Wafer Bonder
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SEMICON Taiwan 2015
SB Micro 2015
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Nemotek Technologie selects EV Group's Solutions for Capacity Ramp
EV Group Strengthens Presence in Middle East
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video