Wafer Bonding Systems
With over 15 years experience in designing and manufacturing precision wafer
bonding equipment, EVG wafer bonding systems are well recognized in setting
industry standards for the MEMS production industry. Besides supporting wafer
level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500
series wafer bonding systems can be configured for R&D, pilot-line or
volume production. They accommodate the most demanding applications by bonding
under high vacuum, precisely controlled fine vacuum, temperature or high
pressure conditions. Multiple bonding methods including anodic, thermo
compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a
unique modular bond chamber design the EVG500 series allow for an easy
technology transfer from R&D to high volume production.