EVG®850TB Automated Temporary Bonding System

For temporary bonding of a substrate on a rigid carrier.

 

The temporary bonding process includes the application of the intermediate material on the carrier wafer before assembly is done in a bond chamber.

The different types of intermediate materials, e.g. thermo-plast adhesives, waxes, resists or tapes require different technologies to apply them on the wafer.

For liquid materials like adhesives, waxes and resists, a spin coating process is used traditionally. The process usually includes spin coating followed by a bake step before the bonding takes place. As for dry film tapes, the tape will be laminated onto the substrate in a lamination station before the final bonding step with the device wafer takes place.

Features

  • Bubble-free bonding in a controlled atmosphere
  • Wide temperature range for low- and high- temperature adhesives and tapes
  • Device wafers are precisely centered with respect to the carrier wafers regardless of diameter differences
  • Various carriers (silicon, glass, sapphire, etc…)
  • Bridge tool capability
  • Modular integration of standardized modules
  • Extendable layout
  • Options
    - ID reading
    - Spray coating