The temporary bonding process includes the application of the intermediate
material on the carrier wafer before assembly is done in a bond chamber.
The different types of intermediate materials, e.g. thermo-plast adhesives,
waxes, resists or tapes require different technologies to apply them on the
wafer.
For liquid materials like adhesives, waxes and resists, a spin coating
process is used traditionally. The process usually includes spin coating
followed by a bake step before the bonding takes place. As for dry film
tapes, the tape will be laminated onto the substrate in a lamination
station before the final bonding step with the device wafer takes place.
Features
- Bubble-free bonding in a controlled atmosphere
- Wide temperature range for low- and high- temperature adhesives and
tapes
- Device wafers are precisely centered with respect to the carrier wafers
regardless of diameter differences
- Various carriers (silicon, glass, sapphire, etc…)
- Bridge tool capability
- Modular integration of standardized modules
- Extendable layout
- Options
- ID reading
- Spray coating