EVG®805 Semi-automated Debonding System

For thin wafer debonding. 

 

The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers. Dependent from the intermediate material, various debond approaches are possible. As for waxes and thermo-plast materials a thermal-activated, mechanical slide-off is utilized. For UV-activated tapes, UV-exposure and wedge-off debond is utilized. The thin wafer can be unloaded on a single substrate carrier for save and reliable transport between tools.

Features

  • Semi-automated thermal release intermediate layer debonding
  • Recipe controlled system 
  • Unique features for thinned wafer handling
  • Various chuck designs to support wafer/substrates and carriers up to 200 mm
  • Options:
    - UV assisted debonding