Temporary Bonding and
Debonding Systems
Increased demand for applications based on thin wafers and thin
microeletronic-substrates result in the need for processing and handling of
thin- and ultra-thin substrates during the manufacturing step. Thin substrates
in the area of IC manufacturing (like memory, CMOS, 3D-TSV integration or
ChipCard applications), power devices (e.g. IGBTs), compound semiconductors
(e.g. for high brightness LEDs or RF-power amplifiers), as well as emerging
technologies that also involve thin or flexible substrates (MEMS; RFID-tags,
flexible displays, etc.) require reliable handling and support techniques in
order to ensure safe processing.