EVG®850 Automated Production Bonding System for SOI
Related Markets
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Advanced Packaging, 3D Interconnect
Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.
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MEMS
Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.
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SOI & Engineered Substrates
SOI (Silicon-on-Insulator) is a semiconductor technology, which enables a full isolation of each electronic component on an integrated circuit by using a buried oxide layer.
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