For SOI, MEMS, compound semiconductors and advanced substrate bonding.
Advanced Packaging and 3D-IC Market driving strong growth for EV Group's automated 300-mm polymer adhesive wafer bonding systems
EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference
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SOI & Engineered Substrates
EV Group Advances SOI Leadership and Presence in China with First Order from SST
EV Group Corporate Video