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  • EVG®301

EVG®301 Semi-automated Single Wafer Cleaning System
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SOI & Engineered Substrates

SOI (Silicon-on-Insulator) is a semiconductor technology, which enables a full isolation of each electronic component on an integrated circuit by using a buried oxide layer.

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News and Events

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

EV Group Ships 300mm Wafer Bonding System to Leading Chinese Semiconductor Foundry

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ECTC 2013

sensors expo & conference 2013

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TBDB_AD_Feb_13
See Also

Related Markets

Tokyo Institute of Technology Installs EVG Wafer Cleaning System for Advanced Optical IC R&D

SOI & Engineered Substrates

EV Group Advances SOI Leadership and Presence in China with First Order from SST

Technical Papers

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EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

2012_05_vlsi
EVG in Top Five of the VLSIresearch 2012 Customer Satisfaction Survey

 
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