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EVG300 Series Short Brochure.pdf
Technical PapersPlease click the titles to download the full papers in PDF formatIntegration of a Temporary Carrier in a TSV Process FlowAbstract: Three-dimensional (3-D) wafer stacking technologies offer new possibilities in terms of device architecture and miniaturization [1-3]. To stack wafers, reliable throughsilicon vias (TSVs) and interconnections must be processed into ultrathin wafers, and such processing is made possible by new methods for wafer handling... Adhesive wafer bonding for wafer-level fabrication of microring resonatorsAbstract: Adhesive wafer bonding for wafer-level fabrication of microring resonators Abstract: GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integration concept with GaInAsP/InP-on-GaAs wafer bonding. BCB adhesive bonding has been identified as the preferred wafer bonding process. This paper reports results on the development of the wafer bonding and on the microring fabrication.Advanced low temperature bonding technologiesAbstract: The different fields and especially ist various applications for micro electro mechanical systems (MEMS) prevent the use of uniform packaging techniques for all types of µ-device. Several bonding techniques performed at wafer-scale, with the advantage of protecting the device against particles, contaminations or even damage during the sawing and dicing process are used right now...Low temperature MEMS manufacturing processes: plasma activated wafer bondingAbstract: This paper introduces a new technology: low temperature plasma activated wafer bonding. In this process, the wafers are submitted to a plasma treatment prior to bringing them into contact for bonding. The surface activation allows process temperature ranging from room temperature to maximum 400°C...III-V wafer bonding technology for wafer-level fabrication of GaInAsP/InP microring resonatorsAbstract: GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integration conecpt with GaInAsP/InP-on-GaAs wafer bonding. BCB adhesive bonding has been identified as the preferred wafer bonding process. This paper reports results on the development of the wafer bonding and on the microring fabrication.Plasma activated wafer bonding: the new low temperature tool for MEMS fabricationAbstract: Manufacturing and integration of MEMS devices by wafer bonding often lead to problems generated by thermal properties of materials. These include alignment shifts, substrate warping and thin film stress. By limiting the thermal processing temperatures, thermal expansion differences between materials can be minimized in order to achieve stressfree, aligned substrates without warpage...
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
EVG and NNFC announced results on improved transparent nanostructured anti-reflective coatings for next-gen displays
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CS International 2017
IMAPS Device Packaging 2017
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Tokyo Institute of Technology Installs EVG Wafer Cleaning System for Advanced Optical IC R&D
SOI & Engineered Substrates
EV Group Advances SOI Leadership and Presence in China with First Order from SST
EV Group Corporate Video