GEMINI® Automated Production Wafer Bonding System
 Related Markets

   

Advanced Packaging, 3D Interconnect

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.

   

Compound Semiconductor and Silicon-Based Power Devices

Microelectronic applications fabricated out of compound semiconductors as well as silicon-based power devices basically require dedicated manufacturing technologies offered by EVG.

   

MEMS

Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.