EVG®40NT Automated Measurement System

For alignment accuracy measurements

 

The EVG40NT Automated Measurement System performs highly accurate, non-destructive top-to-bottom side alignment accuracy measurement on double-sided structured wafers or bond interfaces as well as CD and Box-in-Box measurements of single and/or double side structured wafers. The EVG40NT can accurately measure any type of substrate material up to 300 mm in size. The measurement system is a highly flexible tool capable of measuring across the full wafer surface with an unlimited number of measurement points. With its flexibility it is suitable for different fields of applications like MEMS, sensors, micro-optics, power devices, compound semiconductors and silicon-based power devices, hybrid technology, multi-layers and all technologies that involve double-side lithography

Features

  • Highly accurate, destruction-free alignment accuracy measurement of single- and double-sided structured wafers or bond interfaces 
  •  Repeatable top to bottom side alignment accuracy measurement
  • Non-destructive, visible light, self calibrating technology
  • PC-based measurement system
  • Line Width measurement
  • Infrared measurement (Reflective and transmitted)
  • Option: Handling system for fully automated high throughput operation 
  • Critical Dimension measurement (CD)
  • Overlay/ Box-in-Box measurement (BiB)
  • Cross hair is centered automatically