EVG®20 IR Inspection System

For wafer bond quality inspection.

 

Technical Papers
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Adhesive wafer bonding for MEMS applications
Abstract: Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding...