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Adhesive wafer bonding
for MEMS applications
Abstract: Low temperature wafer bonding is a powerful
technique for MEMS/MOEMS devices fabrication and packaging. Among the low
temperature processes adhesive bonding focuses a high technological
interest. Adhesive wafer bonding is a bonding approach using an
intermediate layer for bonding (e.g. glass, polymers, resists, polyimides).
The main advantages of this method are: surface planarization,
encapsulation of structures on the wafer surface, particle compensation and
decrease of annealing temperature after bonding...