The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live image
of the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG's integrated bonding systems.
- Live imaging
- One-shot inspection of the entire wafer
- Optional bond pin for live visualization of direct bonding
- Maszara test compatible
- Void size detection down to 0.5 mm radius