EVG®20 IR Inspection System

For wafer bond quality inspection.


For qualification of bond quality after pre-bonding, the IR Inspection System gives first information on the bond quality via a stored image. A uniform illumination system and an IR sensitive CCD camera are the main components of the IR-inspection station. Video frame grabbing technology displays the camera image on the process monitor. The image of each wafer can be optionally stored on hard disk drive as graphic file.


  • IR Inspection Station for quality control
  • Automatic image acquisition of all bonded wafer pairs
  • High sensitivity given by high resolution IR-CCD-camera