SmartView®NT Automated Bond Alignment System for Universal Alignment

For wafer-to-wafer alignment via alignment keys in bond interface.

 

  • Substrate / Wafer parameters:
    Size: 150 mm - 200 mm, 200 mm - 300 mm
    Thickness: 0.1 - 5 mm; Max. stack height: 10 mm
  • General system configuration:
    System rack: standard; Vibration isolation: active 
  • Alignment methods:
    SmartView alignment: ± 1.0 µm 3σ
    SmartView alignment: ± 0.5 µm 3σ with fine alignment option 1
    SmartView alignment: ± 0.2 µm 3σ with fine alignment option 2
    Backside alignment: ± 1.0 µm 3σ
    Backside alignment: ± 0.5 µm 3σ with fine alignment option 1
    Backside alignment: ± 0.2 µm 3σ with fine alignment option 2
    Transparent alignment: ± 0.3 µm 3σ
    Transparent alignment: ± 0.1 µm 3σ with fine alignment option 1
  • Alignment stage:
    Precision micrometers: Motorized; Wedge compensation: Internal 
  • Automatic alignment: Standard 
  • Handling system: 3 cassette stations (up to 200 mm) or 2 FOUP load ports / 300 mm