SmartView® Automated Bond Alignment System for Universal Alignment

For wafer-to-wafer alignment via alignment keys in bond interface.

 

  • Substrate / Wafer parameters:
    Size: 50mm - 150mm, 100mm - 200mm, 200mm - 300mm 
    Thickness: 0.1 - 1.5mm for each wafer; Max. stack height: 12mm
  • General system configuration:
    System rack: standard; Vibration isolation: active
  • Alignment methods:
    SmartView alignment: ± 1.3µm 3σ
    Backside alignment: ± 1.5µm 3σ
    Transparent alignment: ± 0.5µm 3σ
    IR alignment: Option
  • Alignment stage:
    Precision micrometers: Motorized; Wedge compensation: Internal
  • Automatic alignment: Standard
  • Handling system: 3 cassette stations (up to 200mm) or 2 FOUP load ports / 300mm