EVG®6200∞ Automated Bond Alignment System

For wafer-to-wafer alignment for subsequent wafer bonding applications.

 

The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

Features

  • Supports bond alignment of double or triple wafer stacks up to 200 mm wafer sizes
  • Manual or motorized alignment stage with automatic alignment option
  • Fully motorized high resolution bottom side microscopes
  • Windows® based user interface
  • Options
    - Automatic alignment
    - IR alignment for inner substrate key alignment
    - NanoAlign® package for enhanced process capabilities
    - Available with system rack
    - Upgrade possibility to mask aligner