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EVG®610 Semi-automated Bond Alignment System
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MEMS

Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.

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EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

EV Group Ships 300mm Wafer Bonding System to Leading Chinese Semiconductor Foundry

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References

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EVG in Top Five of the VLSIresearch 2012 Customer Satisfaction Survey

 
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