EVG®610 Semi-automated Bond Alignment System

For wafer-to-wafer alignment for subsequent wafer bonding applications.

 

  • Substrate / Wafer parameters:
    Size: 2", 3", 100 mm, 150 mm, 200 mm
    Thickness: 0.1 - 10 mm
    Max. stack height: 10 mm
  • General system configuration:
    Desktop system: standard
    Vibration isolation: passive
  • Alignment accuracy:
    Backside alignment: ± 2 µm 3σ
    Transparent alignment: ± 1 µm 3σ
    IR alignment: Option / substrate depending
  • Alignment stage:
    Precision micrometers: Manual
    Wedge compensation: Automated