EVG®610 Semi-automated Bond Alignment System

For wafer-to-wafer alignment for subsequent wafer bonding applications.

 

The EVG610 Semi-automated Bond Alignment System is a flexible desktop unit targeted for R&D and small-scale production needs in MEMS/MST markets. The EVG610 contains a precision alignment stage for optical bond alignment.


Features

  • Wafer and substrate sizes up to 150/200 mm
  • Manual high precision alignment stage
  • Manual operated bottom side microscope
  • Windows ® based user interface
  • Perfect multi user concept (unlimited number of user accounts, various access rights, different user interface languages)
  • Desk top system design with minimum footprint
  • Supports IR alignment process
  • Optimum total cost of ownership (TCO) for R&D and pilot line production