For wafer-to-wafer alignment for subsequent wafer bonding
applications.
The EVG610 Semi-automated Bond Alignment System is a flexible desktop unit targeted for R&D and small-scale production needs in MEMS/MST markets. The EVG610 contains a precision alignment stage for optical bond alignment.
Features
- Semi-automated alignment stage
- Fully motorized high resolution bottom side microscopes
- Windows® based user interface
- IR alignment for inner substrate key alignment
- NanoAlign® package for enhanced process capabilities