Permanent Wafer Bonding: The introduction of EVG's
wafer-bonding approach, which separates the bond alignment from the bonding
step, immediately revolutionized the market. Utilizing high-contact forces
under elevated temperatures and a controlled atmosphere, this novel
approach is today's process standard, with EVG holding the dominant market
share for both semi- and fully automated wafer bonders and a growing
installed base of more than 500 chambers. EVG's wafer bonders offer
manufacturers manifold benefits, including optimal total cost of ownership
(TCO), as well as a real wafer-wedge compensation unit to maximize the
bonding yield. Its bond alignment systems, such as the SmartView Aligner,
can be integrated into a fully automated GEMINI production wafer bonder,
which can support sub-micron alignment accuracies even with non-infrared
(IR) transparent wafers. As it did with MEMS manufacturing, the company is
now leveraging its technology strengths to accelerate the success of 3D
wafer stacking. In support of this technology transfer, EVG developed
chip-to-wafer bonding tools for high-yield heterogeneous 3D integration
schemes and was the first to market with 300mm wafer bonders.
Temporary Wafer Bonding: Building on its success in
permanent wafer bonding, EVG introduced automated, temporary bonding and
debonding technology to address compound semiconductor and 3D IC
manufacturers' immediate need for high-yield processing of ultra-thin and
fragile wafers. The EVG technology temporarily mounts a wafer onto a
carrier by applying thermal or UV-release intermediates (e.g., spin-on
polymers, waxes, resists and dry-film laminates), providing manufacturers
with several key benefits. These include optimal design-process
flexibility, high yield (via the rigid carrier support), ease of
integration into an existing fabrication infrastructure, and a highly
reliable debonding step following complete front and backside processing.