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SOI & Engineered Substrates
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Bonding

EVG®20 IR Inspection Station

The EVG20 is designed for qualification of bond quality after pre-bonding.

EVG®301 Semi-automated Single Wafer Cleaning System

The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield.

EVG®320 Automated Single Wafer Cleaning System

The EVG320 Automated Single Wafer Cleaning System is designed for efficient removal of particles prior to critical process steps in semiconductor processing.

EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.

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VLSIresearch announces THE BEST 2013 Suppliers

VLSIresearch announces winners of the 2013 10 BEST Suppliers of Chip Making Equipment awards

sensors expo & conference 2013

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See Also

Related Products

EV Group Unveils Industry's First Wafer Bonding System for 450mm SOI Semiconductor Wafers

Technical Papers

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

EVG in Top Five of the VLSIresearch 2012 Customer Satisfaction Survey