The heart of an SOI wafer is an ultra-thin, monocrystalline, conducting
layer on a silicon wafer. On this isolated semiconductor layer of the
microchip, all electronic operations take place. Today, wafer bonding is
one of the most important manufacturing methods for SOI wafers. This
technique found its way into industrial mass production, is cost efficient
and production prove.
An essential contribution is achieved with the EVG850 production wafer
bonder from EV Group. For this equipment EVG received the Austrian
Innovation Award 2004 and was announced Austria’s most innovative company.
With this EV Group contributes in the successful development of
microprocessors in which the electrons reach their goal quicker. These
chips obtain higher switching frequencies, lower power consumption and
avoid useless heat production. SOI chips have a 20%-30% higher performance
and consume up to 1/3 less power than chips on conventional silicon.