Nanotechnology
 Related Products

Lithography

   

EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.

   

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

   

EVG®510HE Semi-automated Hot Embossing System

EV Group's EVG510HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

   

EVG®520HE Semi-Automated Hot Embossing System

EV Group's EVG520HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity."

   

EVG®620 Automated UV Nanoimprint Lithography System

The EVG620 Automated UV-NIL System allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter.

   

EVG®6200∞ Automated UV Nanoimprint Lithography System

The EVG6200 Automated UV-NIL System is designed for pattern creation in UV-curable materials from a prestructured stamp to a substrate.

   

EVG®750 Automated Hot Embossing System

EV Group's EVG750 is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

   

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

   

IQ Aligner® Automated UV Nanoimprint Lithography System

The IQ Aligner Automated UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter,

   

NanoSpray™ Technology

EVG's NanoSpray™ Coating Technology enables a new bandwidth of applications throughout many technologies in semiconductor processing markets.

Bonding

   

EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.