Go to the main navigation
Go to content

Nanotechnology
Related Products

Lithography

EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

EVG®150N Automated NanoSpray™ Coating System

EVG®150N Automated NanoSpray™ Coating System allows a new bandwidth of applications throughout many technologies in semiconductor processing markets.

EVG®510HE Semi-automated Hot Embossing System

EV Group's EVG510HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

EVG®520HE Semi-Automated Hot Embossing System

EV Group's EVG520HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity."

EVG®620 Automated UV-NIL, µ-CP System

The EVG620 Automated UV-NIL, µ-CP System allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter.

EVG®6200∞ Automated UV-NIL, µ-CP System

The EVG6200 Automated UV-NIL, µ-CP System is designed for For pattern creation in UV-curable materials from a prestructured stamp to a substrate.

EVG®750 Automated Hot Embossing System

EV Group's EVG750 is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

IQ Aligner® Automated UV-NIL, µ-CP System

The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter,

Bonding

EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

Markets

Advanced Product Search

News and Events

EVG and Dynaloy Jointly Develop Single-Wafer Cleaning Solution

Fraunhofer ISE Teams up with EVG to Enable Direct Semiconductor Wafer Bonds

Photonics Festival 2013

intersolar North America 2013

TBDB_AD_Feb_13

See Also

Related Products

EV Group Breaks through Resolution Barrier with Introduction of Soft UV Nanoimprint Lithography Technology

High Brightness LEDs

Wafer Level Optics

Technical Papers

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

Consortium for Commercialization of Nano Imprint Lithography (NIL)