MEMS

Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.

Brochures
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MEMS_ShortBrochure  
EVG MEMS Short Brochure.pdf


Technical Papers
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Adhesive wafer bonding with photosensitive polymers for MEMS fabrication
Abstract: Adhesive wafer bonding is a technique that uses an intermediate layer (typically a polymer) for bonding two substrates. The main advantages of using this approach are: low temperature processing (maximum temperatures lower than 400°C), surface planarization and tolerance to particles contamination (the intermediate layer can incorporate particles with the diameter in the layer thickness range). The main bonding layers properties required by a large field of applications/designs can be summarized as: isotropic dielectric constants, good thermal stability, low Young’s modulus, and good adhesion to different substrates.

Adhesive wafer bonding for MEMS applications
Abstract: Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding...



Adhesive wafer bonding with SU-8 intermediate layers for micro-fluidic applications
Abstract: Recently adhesive wafer bonding using SU-8 has gained a lot of interest for micro-fluidic devices e.g. lab-on-chip applications. Due to its specific properties as well as the capability to pattern thin and thick layers accurately, SU-8 is an ideal candidate for micro-fluidic components like channels, reservoirs and valves, but also for micro-optical components...



Advanced anodic bonding processes for MEMS applications

Abstract: Anodic bonding is a powerful technique used in MEMS manufacturing. This process is applied mainly for building three-dimensional structures for microfluidic applications or for wafer level packaging. Process conditions will be evaluated in present paper. An experimental solution for bonding three wafers in one single process step (“triple-stack bonding”) will be introduced...



Advanced low temperature bonding technologies
Abstract: The different fields and especially ist various applications for micro electro mechanical systems (MEMS) prevent the use of uniform packaging techniques for all types  of µ-device. Several bonding techniques performed at wafer-scale, with the advantage of protecting the device against particles, contaminations or even damage during the sawing and dicing process are used right now...



Aligned low temperature wafer bonding for MEMS manufacturing: challenges and promises
Abstract: The increased complexity of current generations of MEMS devices imposes new requirements for wafer bonding. Among these can be mentioned low process temperature (<400°C), precise optical alignment of substrates, ability to bond a large variety of substrates and the possibility to bond with defined intermediate layers...



Cyclo-Olefin polymer direct bonding using low temperature plasma activation bonding
Abstract: Low temperature direct bonding method of Cyclo-Olefin Polymer (COP) plates (20mm x 40mm x 2.0mm) has been developed employing surface plasma treatment with various gases such as N2, O2, and 10%-H2/Ar. Surface energy of the bonded interface has been measured by razor blade method...



From magic to technology: materials integration by wafer bonding

Abstract: Wafer bonding became in the last decade a very powerful technology for MEMS/MOEMS manufacturing. Being able to offer a solution to overcome some problems of the standard processes used for materials integration (e.g. epitaxy, thin films deposition), wafer bonding is nowadays considered an important item in the MEMS engineer toolbox...



Investigating the use of spray-coating technology in MEMS applications
Abstract: Fabricating the many different varieties of of microelectromechanical systems (MEMS) poses complex processing challenges, particularly in the lithography area. Since MEMS devices rely on mechanical elements, they incorporate three-dimensional microstructures....



Low temperature MEMS manufacturing processes: plasma activated wafer bonding
Abstract: This paper introduces a new technology: low temperature plasma activated wafer bonding. In this process, the wafers are submitted to a plasma treatment prior to bringing them into contact for bonding. The surface activation allows process temperature ranging from room temperature to maximum 400°C...



New MEMS Manufacturing Technologies
Abstract: New applications for MEMS are driving the need for specialized process technology. After automotive being the driving force in the last decade of commercial MEMS products, we are now entering new MEMS manufacturing era with consumer products and IT (Information Technology) getting the higher volume share...



Plasma activation for low temperature wafer bonding
Abstract: Wafer bonding behavior of plasma activated Si and SiO2 surfaces was investigated. Process evaluation was performed by various experiments. Surface energy of wafer pairs bonded after different storage times at room temperature and after thermal annealing at 300°C was investigated as a measure of surface activation lifetime...



Plasma activated wafer bonding for MEMS
Abstract:  Wafer bonding became a key technology in various MEMS devices manufacturing. In this respect, wafer bonding is a very important technology as far as it enables not only 3D structure building but also wafer level packaging ...



Plasma activated wafer bonding of silicon: in situ and  ex situ processes
Abstract: Plasma activated wafer bonding generated a high interest in last decade due to the important process temperature reduction. With the main advantage of bringing some applications at industrial degree of feasibility. An example of process which benefits from this new process is silicon fusion bonding: by using plasma activation the bond process temperature and time are reduced at values which make wafer bonding compatible with industrial manufacturing requirements...



Plasma activated wafer bonding: the new low temperature tool for MEMS fabrication
Abstract: Manufacturing and integration of MEMS devices by wafer bonding often lead to problems generated by thermal properties of materials. These include alignment shifts, substrate warping and thin film stress. By limiting the thermal processing temperatures, thermal expansion differences between materials can be minimized in order to achieve stressfree, aligned substrates without warpage...



Spray coating for MEMS, NEMS and Micro Systems
Abstract: In the semiconductor and MEMS industry there is a requirement for uniform resist layers over highly integrated device structures. To achieve a precise line width, it is required to develop a coating process in which there are no coating defects, high coating uniformity over structures, and little to no edge bead...



Tried and tested bonding for MEMS
Abstract: As markets for MEMS devices grow, there is a parallel need for productive manufacturing techniques to ensure MEMS manufacturing can develop any good potential. Despite being an emerging technology many manufacturing methods have already been tried and tested in other fields...



Triple-stack anodic bonding for MEMS applications
Abstract: Wafer bonding techniques are key technologies for MEMS devices fabrication. Anodic bonding is a very mature technique used for wafers stacking or wafer level packaging. This paper reports results on a process allowing Glass - Si - Glass and Si - Glass - Si triple-stacks bonding in a single process step...



Ultra-thick lithography for advanced packaging and MEMS
Abstract: An ever increasing need exists for thick resist layers in the processing of MEMS and for advanced packaging.  Applications in the MEMS field include bulk micromachining, surface micromachining, and the actual creating of active device structures... 



Wafer Bonding of Plasma Activated Surfaces
Abstract: Wafer bonding behavior of plasma activated Si and SiO2 surfaces was investigated. Process evaluation was performed by various experiments. Surface energy of wafer pairs bonded after different storage times at room temperature and after thermal annealing at 300°C was investigated as a measure of surface activation lifetime...



Wafer-level plasma activated bonding: new technology for MEMS fabrication
Abstract: Manufacturing and integration of MEMS devices by wafer bonding often lead to problems generated by thermal properties of materials. These include alignment shifts, substrate warping and thin film stress. By limiting the thermal processing temperatures, thermal expansion differences between materials can be minimized in order to achieve stress-free, aligned substrates without warpage...