MEMS

Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.



80µm SU-8 resist features with sidewall angles approaching 90°.
Courtesy of DALSA Corporation.


MEMS Accelerometer.
Courtesy of ST Microelectronics. 


MEMS Gyroscope application.
Courtesy of Apple.


Sub-µm high-aspect ratio structures
created with DUV-Lithography.
Courtesy of CEETAM.


NanoSpray coating, 100µm diameter and 300µm depth. Source EVG.


8-layer direct bond cross-section. Courtesy of MIT.


MEMS Microphone.
Courtesy of Akustika.


Patterned, spray coated resist layer in anisotropically etched cavity. Courtesy of TU-Delft DIMES.


High-Q-3D solenoid industors for RF ICs. Courtesy of SIMIT.


Glass-frit bond interface.
Courtesy of ST Microelectronics.