Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.
80µm SU-8 resist features with sidewall angles approaching 90°. Courtesy of DALSA Corporation.
MEMS Accelerometer. Courtesy of ST Microelectronics.
MEMS Gyroscope application. Courtesy of Apple.
Sub-µm high-aspect ratio structures created with DUV-Lithography. Courtesy of CEETAM.
NanoSpray coating, 100µm diameter and 300µm depth. Source EVG.
8-layer direct bond cross-section. Courtesy of MIT.
MEMS Microphone. Courtesy of Akustika.
Patterned, spray coated resist layer in anisotropically etched cavity. Courtesy of TU-Delft DIMES.
High-Q-3D solenoid industors for RF ICs. Courtesy of SIMIT.
Glass-frit bond interface. Courtesy of ST Microelectronics.
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